New thermal paste from OCZ
OCZ is further expanding its portfolio of cooling products and is presenting a new thermal paste called ' Freeze '. Thanks to a mixture of new materials, it should have a higher thermal conductivity (3.8 W/m * K) than products based on silver compounds and be able to lower the temperature of the processor by up to ten percent.
This will also be the case Favored by the low viscosity of the thermal paste, so that it should be able to apply it as thinly as possible to the cooler and processor without major problems, which is much more difficult with the rather tough silver compounds. We do not yet have any information on the price and availability of the thermal paste, which is available in 3 ml syringes.