Intel converts first chip factory to 300 millimeter wafers
Intel will not be producing 200 millimeter wafers as planned in its factory in Leixlip, Ireland, but 300 millimeter wafers. The facilities with the name Fab 24, which are currently under construction, still have to be changed, which means that production cannot start as planned in 2001, but only from 2002.
Waver serves as a Base material from which chips are extracted. Compared to the round discs with a diameter of 200 millimeters, twice as many chips can be produced from the wafers with a diameter of 300 millimeters, whereby production costs are reduced by an even 30 percent. In addition, Intel is about to complete a development plant in Hillsboro, Oregon and is also building another production facility in Rio Rancho, New Mexico.