IDF: Intel produces 0.13 µ CPUs on 300 mm wafers
According to its own statements, Intel is the first chip manufacturer to manufacture CPUs in 0.13 µ technology on 300 mm silicon wafers as series products. In Hillsboro, Oregon, the D1C production line has started production of processors on schedule.
The 300 mm (12 inch) wafers have an area 2.25 times larger than the conventional 200 mm (8 inch) wafers Due to the lower 'waste', 2.4 times more ICs fit on the larger wafers. According to Intel, the simultaneous reduction in energy and water consumption during manufacture has reduced production costs per CPU by 30 percent. According to Intel's 'Technology and Manufacturing Group' boss Sunlin Chou, the yield is four times higher than the previous 0.18 µ CPUs and 200 mm wafers. Infineon had already started series production of memory chips on 300 mm wafers in Dresden last December.