Fujitsu announces ultra-slim chips
With today's technology, semiconductor heights of 100-150 micrometers are possible; if chemicals are still used in the polishing process, the height drops to below 100 micrometers, but this is associated with increased environmental pollution.
The Japanese Fujitsu group has now developed a process with which it should be possible to manufacture chips with a height of only 25 micrometers without breaking the wafer during polishing. This is particularly important for telecommunication devices in which the chip height is up to 150 micrometers, with common chip cards it is only 50 micrometers. The main problem when polishing the wafers, the mechanical stress, wants to solve Fujitsu with a special clamping process, which should prevent any deformation. The technology was developed in cooperation with the Tokyo company Disco.