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AMD, Infineon and UMC develop new technology for chip production

AMD, Infineon and UMC develop new technology for chip production

AMD, Infineon and UMC today announced plans to jointly develop a uniform platform technology for the high-volume production of logic chips with feature sizes of 65 nm and 45 nm on 300 mm wafers.

Each of the three companies will provide development capacities and know-how in order to jointly develop a uniform platform technology that can be adapted by each company to its specific manufacturing and product requirements. The development program will initially start at a UMC plant in Hsinchu, Taiwan. With this step, Infineon is expanding the existing agreement with UMC for the joint development of process technology for structures of 130 nm and 90 nm and at the same time will join the UMC and AMD program for the development of process technology for structure sizes of 65 nm and 45 nm, which is already under It was announced in spring.

'The development efforts with UMC and Infineon will form the basis for AMD's 65 and 45 nanometer manufacturing technologies form and allow AMD to set additional development priorities in process technology areas that are critical for our business and our customers, such as high-performance transistors and chip-internal connections (interconnects). '

Infineon and UMC are building with this important research and Development program, which includes the 300 mm manufacturing joint venture UMCi in Singapore. UMCi is expected to be ready for the installation of the equipment in January 2003; mass production should start up in the fourth quarter of the year.