40GHz processors from Intel
According to Intel, the processors will run 20 times faster than current processors in 2009. For this, Intel has developed a new technology called Bumpless Build Up Layer (BBUL).
So far the circuits of a chip are applied to a small silicon wafer. This chip is then placed on the surface of a processor package. The new technology should make it possible to integrate the structures of a processor directly into the processor package. This not only makes these packages flatter, but also more efficient. In an interview with Computer-Channel, Intel manager Manny Vara explained the advantages of the new manufacturing option: “We can integrate an entire system in one package. It is conceivable, for example, that a card with such a package can be removed from a PC and then inserted into a slot in the car - so that all the information from the PC is available at home while on the move For example, integrating main memory or graphics components in a single chip, finally realizing the vision of a Walkman-sized computer.